Intel Haswell 3rd generation Core release date and specifications

Intel is going like a quartz with its tick-tock CPU development strategy and officially set the release date of the next generation Intel's Haswell architecture to March/April 2013, according to a roadmap leaked by Intel.

The Intel's Haswell architecture is build using 22nm process technology, so Intel is now on the "Tock" part of the loop, as the Intel's "Tock" mean a new x86 architecture and the Intel's "Tick" is a newer silicon fabrication process coming, the new intel Haswell or 3rd generation of Core i7/i5/i3 will use LGA1150 for desktop and rPGA947 & BGA1364 for the mobile and supporting DirectX 11.1 graphics and more.

Latest Intel Desktop CPUs roadmap:

Bellow a recap of what is expected next year from Intel on the Haswell chip (via wiki.)

Haswell Specifications:

A 22 nm manufacturing process.
3D tri-gate transistors (Ivy Bridge processors and onwards).
A 14 stage pipeline (since the Core microarchitecture).

Haswell is confirmed to have:

Advanced Vector Extensions 2 (AVX2) instruction set, also called Haswell New Instructions. (includes gather, bit manipulation, and FMA3 support).
Direct3D 11.1 and OpenGL 3.2 graphics unit.
Intel Transactional Synchronization Extensions (Intel TSX).

Haswell is expected to have:

A new cache design.
Thunderbolt technology.
Integrated GPU up to 20 EUs.
New advanced power-saving system.
1MB L2 cache per core and up to a 32MB L3 cache.
New sockets - LGA 1150 for desktops and rPGA947 & BGA1364 for the mobile market.
Fully integrated voltage regulator, thereby moving another component from the motherboard onto the CPU.
37, 47, 57W TDP mobile processors.
35, 45, 65, 95W TDP desktop processors.
15W TDP processors for the Ultrabook platform (multi-chip package like Westmere).