Intel is going like a quartz with its tick-tock CPU development strategy and officially set the release date of the next generation Intel's Haswell architecture to March/April 2013, according to a roadmap leaked by Intel.
The Intel's Haswell architecture is build using 22nm process technology, so Intel is now on the "Tock" part of the loop, as the Intel's "Tock" mean a new x86 architecture and the Intel's "Tick" is a newer silicon fabrication process coming, the new intel Haswell or 3rd generation of Core i7/i5/i3 will use LGA1150 for desktop and rPGA947 & BGA1364 for the mobile and supporting DirectX 11.1 graphics and more.
Latest Intel Desktop CPUs roadmap:
Bellow a recap of what is expected next year from Intel on the Haswell chip (via wiki.)
- A 22 nm manufacturing process.
- 3D tri-gate transistors (Ivy Bridge processors and onwards).
- A 14 stage pipeline (since the Core microarchitecture).
Haswell is confirmed to have:
- Advanced Vector Extensions 2 (AVX2) instruction set, also called Haswell New Instructions. (includes gather, bit manipulation, and FMA3 support).
- Direct3D 11.1 and OpenGL 3.2 graphics unit.
- Intel Transactional Synchronization Extensions (Intel TSX).
Haswell is expected to have:
- A new cache design.
- Thunderbolt technology.
- Integrated GPU up to 20 EUs.
- New advanced power-saving system.
- 1MB L2 cache per core and up to a 32MB L3 cache.
- New sockets - LGA 1150 for desktops and rPGA947 & BGA1364 for the mobile market.
- Fully integrated voltage regulator, thereby moving another component from the motherboard onto the CPU.
- 37, 47, 57W TDP mobile processors.
- 35, 45, 65, 95W TDP desktop processors.
- 15W TDP processors for the Ultrabook platform (multi-chip package like Westmere).
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